A power amplifier module can have a favorable ceramic thermal value and still miss its temperature margin beca...
A power amplifier module can have a favorable ceramic thermal value and still miss its temperature margin beca...
Volume release exposes the difference between a ceramic layout and a ceramic process. Screen, thick-film, thin...
When a microwave path becomes long enough, the material name alone cannot explain insertion loss. A PTFE PCB c...
A ceramic substrate can be electrically stable and thermally efficient while the interconnect still becomes th...
A high-power RF module can meet its electrical target and still fail in the field because the heat path was ne...
The Megtron 6 PCB connector launch remains the shared datum for SI and assembly inspection. The production Meg...
Table of Contents PTFE drilling and stackup RF drill table and transition geometry Desmear and plating control...
Taconic RF-35 PCB power amplifier thermal work must preserve two things at once: the device must shed heat, an...
TLY-5 PCB beamformer thermal design is a coupled RF and power problem. In a phased array, each channel must pr...
A TLY-5 PCB via field is not a cosmetic layout detail in a Ku-band module. The plated transition decides where...