What is a Buried Via PCB? A Buried Via PCB is a multilayer printed circuit board where vias are located between internal layers only, without extending to the outer layers. Unlike through-hole vias, a buried via PCB allows connections between inner layers while keeping the outer layers free for routing, enabling higher circuit density and...
What is an HDI PCB? An HDI PCB (High-Density Interconnect PCB) is an advanced printed circuit board designed with higher wiring density per unit area, using technologies such as microvias, fine lines, and sequential lamination. Compared to conventional PCBs, an HDI PCB enables more compact layouts, improved electrical performance, and higher signal density, making it...
What is a Fine Line PCB? A Fine Line PCB refers to a printed circuit board with extremely narrow trace width and spacing, typically below 100 μm (4 mil) and often reaching 50 μm (2 mil) or less in advanced designs. These PCBs are essential for high-density interconnect (HDI) and miniaturized electronic products, where space...
What Is a BT Epoxy PCB? A BT Epoxy PCB is a high-performance PCB built using BT epoxy resin (Bismaleimide-Triazine), a material widely used in IC substrate and semiconductor packaging applications. Compared to standard FR-4, a BT Epoxy PCB offers: Higher glass transition temperature (Tg) Lower dielectric loss Better dimensional stability Improved reliability under thermal...
What Is a Fine Line PCB? A Fine Line PCB refers to a board manufactured with extremely narrow trace width and spacing, typically: ≤100 µm (4 mil) → standard fine line ≤75 µm (3 mil) → advanced ≤50 µm (2 mil) or below → ultra-fine line These geometries go beyond conventional PCB fabrication limits and...
Why Microvias Are Critical in Modern PCB Design As electronic devices continue to shrink while performance demands increase, traditional through-hole vias become a limiting factor. Microvias solve this by enabling high-density interconnects with shorter electrical paths. They are essential when: BGA pitch ≤ 0.8 mm (especially ≤ 0.5 mm) Routing congestion limits layout feasibility High-speed...
What Actually Defines an HDI PCB？ An HDI PCB (High-Density Interconnect PCB) is not defined by layer count alone, but by how efficiently interconnections are implemented. The key differentiators are: Microvias (laser-drilled vias) Blind and buried vias Fine line and spacing (typically ≤100 µm) High connection density per unit area The goal of HDI is...
Why HDI PCBs Are No Longer Optional As electronic devices become smaller, faster, and more complex, traditional multilayer PCB designs struggle to keep up. HDI (High-Density Interconnect) PCBs address this challenge by enabling higher routing density, shorter signal paths, and better electrical performance. At the core of HDI technology is the use of: Microvias (laser-drilled...
Why Buried Vias Matter As electronic systems become more compact and performance-driven, traditional via structures are no longer sufficient for complex routing requirements. A Buried Via PCB enables connections only between internal layers, eliminating unnecessary vertical paths through the entire board. This design approach is not just about saving space—it is about engineering control over...
A Blind Via PCB is a multilayer printed circuit board that uses vias connecting an outer layer to one or more inner layers without extending through the entire board. Unlike through-hole vias, blind vias do not penetrate all layers, allowing for high-density routing, reduced board size, and improved signal integrity. Blind via technology is critical...
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