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high-frequency PCB - KKPCB

Satellite PCB Radiation Design for LEO Avionics: Dielectrics, Planes, and Shielded Returns

Satellite PCB radiation design for low-Earth-orbit avionics is often reviewed too late as a materials choice. The difficult question is not whether a board can route a signal; it is whether the dielectric, copper stack, enclosure bond, and return current still behave predictably after radiation exposure, thermal cycling, launch handling, and repeated engineering changes. A...

Ku/Ka Satellite PCB Launch Design: Taming Connector and Via Transitions at 30 GHz

For Satellite PCB launch design, a Ku/Ka payload can meet its schematic targets and still lose margin at the board edge. The connector, launch pad, reference plane, via field, and enclosure datum form one electromagnetic interface. The Satellite PCB release must hold that board-to-enclosure datum constant across design and manufacturing. At 30 GHz, even a...

RF-35 PCB Thermal Stability: Controlling CTE, Registration, and Drill Reliability

Thermal drift is an electrical problem when a microwave board moves enough to change trace geometry, connector alignment, or plated-hole stress. This article treats RF-35 PCB as a production material choice and focuses on the thermal-mechanical controls that keep a high-frequency design repeatable from panel build through assembly. Taconic RF-35 typical property tables report a...

RO3003 PCB Thermal Design for High-Power RF Modules

Engineering intent. High-power RF modules combine heat, current, and microwave loss in a small area. This article presents a practical workflow for using an RO3003 PCB as part of a thermal-aware RF module. It is a design guide, not a customer case study or a measured KKPCB result. RO3003 is a ceramic-filled PTFE laminate in...

RO3003 PCB Phased-Array Feed Network Layout

Engineering intent. A phased array can lose beam accuracy when equal-looking traces have different electrical lengths or transitions. This article explains how to plan an RO3003 PCB feed network for a conceptual phased-array module. It separates layout targets from measured production data and does not claim a KKPCB customer case study. RO3003 belongs to the...

High-Frequency PCBs for RF Applications: Materials, Manufacturing, and Design

High-frequency PCBs (Printed Circuit Boards) are critical components in modern wireless communication systems. They handle RF (Radio Frequency) signals that range from 300 MHz to 300 GHz, a spectrum used by technologies like 5G, IoT devices, radar systems, and satellite communications. These signals need to travel long distances without losing power or clarity, which is where high-frequency PCBs play...

High Frequency PCB OEM: End-to-End Manufacturing Solutions for RF and Microwave Applications

As RF, microwave, and high-speed communication technologies continue to evolve, partnering with a reliable high frequency PCB OEM is critical for companies seeking consistent performance, stable quality, and scalable manufacturing. High frequency PCBs operate at GHz and millimeter-wave ranges, where even small variations in materials or processes can significantly impact signal integrity. This article explains...