Megtron 6 PCB projects often fail late for a simple reason: the electrical loss budget was written before the ...
Megtron 6 PCB projects often fail late for a simple reason: the electrical loss budget was written before the ...
TLY-5 PCB beamformer thermal design is a coupled RF and power problem. In a phased array, each channel must pr...
A TLY-5 PCB via field is not a cosmetic layout detail in a Ku-band module. The plated transition decides where...
At microwave frequencies, the connector launch is often the first place where a good laminate stackup loses re...
A 5G antenna feed can pass a nominal impedance check and still lose margin when a plated via, unused barrel, o...
At 77 GHz, a promising RF launch can lose margin when the transition, return path, and enclosure reference are...
Reliable RF transitions are often lost at the connector, launch, or layer change rather than in the long trans...
When a radio board combines a 5G front end, clock distribution, and digital processing, stackup selection beco...
At millimeter-wave frequencies, a small dielectric or registration change can move the phase of an antenna fee...
Duroid PCB: Ultra-Low Loss Material for RF & Microwave Applications In today’s high-frequency world, indus...