Thin radar modules often force an uncomfortable trade-off: the RF launch wants a stable reference plane while the mechanical envelope pushes the stackup toward finer features. This engineering guide uses the RO4835 PCB to explain how an HDI build can be reviewed without confusing design intent with measured qualification data. Define the thin-module constraint first...
Engineering Context / Abstract As BGA pitch decreases and data rates rise, the vertical interconnect becomes part of the transmission channel rather than a simple electrical hole. A plated through-hole may consume routing area, create an unused via stub, interrupt the return path, and add parasitic capacitance and inductance. Advanced systems therefore require specialized PCB...
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