TSM-DS3 is a high-performance RF and microwave laminate with low Df, stable Dk, and excellent thermal reliability for high-frequency PCB and RF circuit applications.
TSM-DS3 is a high-performance RF and microwave laminate with low Df, stable Dk, and excellent thermal reliability for high-frequency PCB and RF circuit applications.
ThinFlex-A A-2010RD is a high-performance adhesiveless double-sided copper clad laminate designed for high-frequency, high-speed, and high-temperature PCB applications.
CLTE-AT laminates are advanced low-loss, ceramic-filled PTFE composites designed for high-frequency applications. Ideal for RF, microwave, and millimeter-wave circuits, they offer excellent thermal, mechanical, and electrical stability for aerospace, automotive, telecommunications, and medical electronics.
Explore comprehensive fabrication guidelines for CLTE Series laminates, ceramic-filled PTFE composites for high-frequency PCBs. Learn expert tips on storage, handling, drilling, lamination, etching, plating, routing, and cutting to ensure superior electrical performance and dimensional stability.
CLTE Series ceramic-filled PTFE laminates deliver exceptional electrical performance, thermal stability, and mechanical strength for advanced RF, microwave, and millimeter-wave PCB designs, ideal for phased array antennas, automotive radar, and aerospace applications.
KKPCB provides professional RF and microwave PCB manufacturing using CLTE Series high-frequency laminates. Explore detailed processing guidelines, lamination, drilling, plating, and routing parameters to achieve zero-defect, high-precision PCB fabrication.
HF-140 is a high-performance high-frequency laminate designed for RF, microwave, and high-speed digital applications. Featuring low signal loss, stable dielectric constant, excellent thermal reliability, and low moisture absorption, HF-140 is ideal for telecommunications, automotive radar, aerospace, 5G infrastructure, and high-speed digital systems.
KB6160+FR4 is a hybrid PCB laminate combining high-frequency KB6160 material with standard FR4 epoxy. It offers low dielectric loss, stable electrical performance, thermal and mechanical reliability, and cost-effective multilayer PCB design for telecommunications, automotive ADAS, aerospace, and high-speed digital circuits.
Optimize fabrication and achieve high-frequency performance with CLTE Series laminates. Storage, handling, drilling, lamination, plating, and routing guidelines for RF, microwave, and millimeter-wave applications.