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RF Module Packaging - KKPCB

RO3003 PCB Thermal Design for High-Power RF Modules

Engineering intent. High-power RF modules combine heat, current, and microwave loss in a small area. This article presents a practical workflow for using an RO3003 PCB as part of a thermal-aware RF module. It is a design guide, not a customer case study or a measured KKPCB result. RO3003 is a ceramic-filled PTFE laminate in...

Innovative printing solutions for front-end RF module packaging

With the rapid development of 5G communication, IoT devices, satellite communication, and advanced wireless systems, RF front-end (RFFE) modules are becoming increasingly compact while requiring higher performance, lower signal loss, and improved reliability. The RF front-end module integrates critical components such as: Power amplifiers (PA) Low-noise amplifiers (LNA) Filters Switches Duplexers Antenna tuning circuits As...