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thermal spreading - KKPCB

Alumina PCB Thick-Film RF Modules: Balancing Thermal Spreading and Layout Density

Alumina remains a practical ceramic substrate for RF modules, sensor hybrids, and compact power interfaces because it combines electrical insulation with a stable mechanical base. The challenge is density. A Alumina PCB can carry thick-film conductors, thin-film features, soldered parts, and a thermal interface in a small area, but every added pad or crossover changes...