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RF power - KKPCB

Ceramic PCB Metallization and Via Reliability: A Practical Review for RF Power Boards

A ceramic substrate can be electrically stable and thermally efficient while the interconnect still becomes the weak point. Metallization adhesion, plated or filled vias, copper thickness, and the transition to a connector or carrier all experience different mechanical strain. For a Ceramic PCB used in a power or microwave module, the correct question is not...