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copper stress - KKPCB

Alumina PCB High-Power Reliability: Thermal Cycling, Copper Stress, and Interface Design

A high-power Alumina PCB can carry heat efficiently only when the copper, substrate, solder or braze, and metal carrier move together. Repeated temperature change makes the interface a mechanical system. The most common project mistake is to qualify the ceramic coupon while the product uses a different copper area, fastener pattern, or thermal interface. A...