Blog

Explore the KKPCB Blog for the latest PCB manufacturing and assembly news, industry insights, expert tips, and technology trends, helping you stay informed and optimize your electronics projects.
RO1200 Bondply Data Sheet

The XtremeSpeed™ RO1200™ Bondply from Rogers Corporation offers ultra-low dielectric loss, excellent thermal stability, and mechanical reliability for high-speed digital applications, including HPC servers, backplanes, and automated test equipment.

N4800-20

N4800-20 is a high-speed, low-loss epoxy laminate from AGC Multi Material America, designed for advanced multilayer PCBs. With Tg 210°C, Dk 3.6, and Df 0.007, it ensures excellent signal integrity, CAF resistance, and thermal stability for high-speed networking, routers, and 5G communication systems.