Why BGA Assembly Is Critical in Modern PCB Design As electronic devices move toward miniaturization, high-speed performance, and high pin-count integration, the Ball Grid Array (BGA) assembly has become a mainstream packaging technology in: Microprocessors (CPU/GPU) FPGAs High-speed communication ICs Memory devices (DDR, LPDDR) Compared with traditional packages (QFP, SOP), BGA offers: Higher I/O density...



