Learn the fabrication guidelines for Rogers RO1200 XtremeSpeed® laminates. Get detailed processing instructions for drilling, lamination, etching, and handling to ensure high-performance, reliable high-speed PCB designs.
Learn the fabrication guidelines for Rogers RO1200 XtremeSpeed® laminates. Get detailed processing instructions for drilling, lamination, etching, and handling to ensure high-performance, reliable high-speed PCB designs.
RO1200 laminates from Rogers’ XtremeSpeed™ series deliver ultra-low loss, stable dielectric performance, and excellent thermal and mechanical reliability. Ideal for high-frequency applications in 5G, aerospace, defense, and high-speed digital circuits.
Rogers’ RO1200 Quick Reference Processing Guidelines provide essential recommendations for drilling, deburring, metallization, and final circuitization to ensure optimal performance and reliability in high-frequency PCB applications.
The XtremeSpeed™ RO1200™ Bondply from Rogers Corporation offers ultra-low dielectric loss, excellent thermal stability, and mechanical reliability for high-speed digital applications, including HPC servers, backplanes, and automated test equipment.
Explore Rogers XtremeSpeed™ RO1200™ laminates, engineered for high-speed digital and RF PCBs. Ultra-low loss, ceramic-filled PTFE with woven-glass reinforcement ensures exceptional signal integrity, mechanical stability, and manufacturability. Ideal for telecom, aerospace, and high-performance computing.
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