Explore how soldering temperature affects copper adhesion and reliability of RT-duroid 5870 high-frequency PCBs. Optimize your RF PCB soldering process.
Explore how soldering temperature affects copper adhesion and reliability of RT-duroid 5870 high-frequency PCBs. Optimize your RF PCB soldering process.
Explore RT-duroid 5870 and 5880 microwave laminates with proven cryogenic performance, low loss, and dimensional stability for high-frequency NASA and space applications.
Discover RT-duroid 5870 PTFE-based laminates with low dielectric constant, ultra-low loss tangent, and excellent thermal stability for RF, microwave, and aerospace applications.
RT/duroid 5870 and 5880 laminates offer stable Dk, low dielectric loss, and excellent mechanical properties for high-frequency, RF, and microwave PCB applications.
RT-duroid laminates offer ultra-low dielectric loss, stable Dk, and high thermal stability for RF, microwave, and high-frequency PCB applications in aerospace, defense, and telecom.
RT-duroid 5870 and 5880 laminates offer nearly isotropic dielectric properties, ultra-low loss, and stable Dk for high-frequency RF, microwave, and multilayer PCB applications.
Learn RT-duroid 5870 and 5880 fabrication best practices for high-frequency PCB applications. Includes drilling, etching, lamination, soldering, routing, and quality assurance tips.
RT-duroid® laminates deliver exceptional dielectric stability, low loss, and thermal reliability for NASA’s cryogenic microwave and deep-space communication systems.
RT-Duroid 5870-5880 PTFE laminates with glass microfiber reinforcement deliver stable dielectric constant, low loss tangent, and excellent thermal stability. Ideal for RF, microwave, 5G, satellite, and aerospace PCBs requiring high signal integrity and reliability.