PCB Manufacturing Services | High-Quality PCB & PCBA - KKPCB

Wiring Overview and Principles With the rapid development of high-speed circuit design, PCB routing has evolved beyond simple interconnection tasks. Engineers must analyze various distributed parameters using transmission line theory. Distributed parameter circuits account for spatial variations in voltage and current. Modern PCBs, with their complexity and density, include advanced features like microvias, buried/blind vias, and...

LTCC (Low Temperature Co-fired Ceramic) is a special type of ceramic material that integrates multiple ceramic layers together through a co-firing process. With its unique performance advantages, LTCC has found widespread application in circuits and systems operating at microwave, millimeter-wave, and higher frequencies. This article will discuss the classification, advantages, and disadvantages of LTCC in detail....

Low dielectric loss characteristics (tan δ) and low resistance conductors, low electrical loss, suitable for high-frequency applications Due to our unique manufacturing technology, the size and characteristics of each production batch and within each batch vary little High-density wiring is achieved by improving stacking alignment accuracy Precise control of substrate thickness and cavity shape Resistance,...

The thermal expansion coefficient of these LTCC substrates is adjusted for use as wafer-level packaging substrates. The substrate surface has bumps for electrical connections, and CSP (chip-scale package) can be easily assembled by directly bonding to silicon wafers. Ideal for MEMS and semiconductor ceramic packages with a small number of leads. Features Benefits of using ceramic wafers...

KKPCB LTCC substrates with silver conductor material provide multilayer substrates with low dielectric loss. Coils, capacitors and resistors can be embedded in the inner layer. Ideal for high-frequency modules and silicon wafer interposer substrates. Features KKPCB LTCC substrates can embed coils, capacitors and resistors, thereby reducing the substrate size. Excellent dimensional tolerance of ±0.3% improves mounting accuracy. Low conductor...

Shenzhen KKPCB Technology Co., Ltd. is a company that specializes in the design, manufacture, and assembly of various printed circuit boards (PCBs), including ceramic substrates. Below is a comprehensive guide to ceramic substrates as presented by the company: Introduction to Ceramic Substrates Ceramic substrates are advanced materials used in electronic packaging due to their excellent thermal, electrical,...

KKPCB’s high-purity porous alumina substrates have excellent surface flatness and are lightweight, making them ideal for sintering tool materials. Features As sintering tool materials – high-purity alumina substrates with excellent surface flatness help improve the characteristics, quality and yield of sintered products. They are also ideal for sintering highly reactive materials. A variety of porosity levels are available...

KKPCB HTCC substrate is a multilayer circuit substrate made of Pt conductor and alumina ceramic co-fired, and also has a cavity structure. Features The new KKPCB HTCC substrate uses platinum conductor, which is extremely chemically stable and not easy to oxidize, and can be used in various high-temperature environments. Compatible with SDG, and does not require...

KKPCB Glazed substrates have excellent surface flatness and minimal surface defects, making them ideal for thermal print heads used in fax machines, copiers and various printers. Features A wide range of glaze thicknesses, from 30μm to 200μm. Heat storage and heat dissipation can be controlled by adjusting the glaze thickness. Full-surface glaze or partial-surface glaze designs...

Shenzhen KKPCB Technology Co., Ltd.’s Alumina-Zirconia substrates have high strength and toughness. Their excellent electrical and thermal properties are ideal for applications that require high reliability, such as automotive, industrial machinery, and IGBT power modules. Features KKPCB’s high-strength flexible Alumina-Zirconia substrates have a bending strength that is more than 1.5 times that of standard alumina substrates. The thinnest...