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power integrity - KKPCB

Optimizing Power Integrity and EMI Suppression Using Taconic TLY-5 PCB Substrates in High-Speed Laptop and Server Motherboards

1. Engineering Overview / Abstract   As laptop and server platforms evolve toward higher CPU core densities and faster DDR5 and PCIe 5.0 interfaces, maintaining stable power integrity and effective EMI suppression has become an engineering priority.  Taconic TLY-5 PCB substrates—PTFE-based laminates with ultra-low Df (0.0009 @ 10 GHz) and stable Dk (2.20 ± 0.02)—offer...

Improving Power Integrity and EMI Suppression with Taconic RF-35 PCBs in High-Speed Laptop and Server Motherboards

1. Engineering Overview / Abstract   As modern laptops and server motherboards transition toward 28–56 Gbps transmission lanes and high-core-count processors, the PCB substrate must ensure minimal voltage ripple, low EMI radiation, and stable impedance performance.  Taconic RF-35, with its low-loss dielectric constant (Dk = 3.50 ± 0.05) and dissipation factor (Df = 0.0018 @...

Ptimizing Power Delivery and EMI Suppression with TLY-5 PCB Substrates in High-Speed Laptop and Server Motherboards

1. Engineering Overview — Power and EMI Challenges in High-Speed Computing Boards   As laptops and enterprise servers transition to PCIe 5.0/6.0 and DDR5 architectures, maintaining power integrity (PI) and electromagnetic interference (EMI) control becomes a core constraint in multilayer PCB design.  The TLY-5 PCB, with its ultra-low Dk (2.20 ± 0.02) and low Df...

Hybrid Stackup Design Using Duroid 6010 PCB for High-Density RF and Microwave Packaging

The Challenge — Miniaturization vs. RF Integrity   In the race toward smaller, lighter, and more integrated microwave systems, engineers face an unavoidable trade-off: how to pack more functionality—LNAs, filters, phase shifters, power amplifiers—into limited PCB real estate without compromising signal integrity or dielectric stability.   Rogers Duroid 6010, with its high dielectric constant (Dk...