high-density PCB stackup - KKPCB
 
HomeTag

high-density PCB stackup - KKPCB

Optimize Thermal Reliability Using High-Density Satellite PCB Stackups in Next-Generation LEO Constellation Terminals

LEO constellation terminals—whether phased-array user antennas, gateway stations, or compact mobile terminals—are being pushed toward wideband RF performance, higher transmit power, and increasingly integrated architectures.This raises a persistent engineering challenge: how to maintain thermal reliability inside a multilayer high-density PCB where RF, digital, and power systems coexist in tight proximity. At orbital altitudes, temperature swings...

Optimize Thermal Resilience and Multi-Layer Signal Fidelity with Megtron 7 PCB Stackups in High-Performance Computing Modules

High-performance computing modules in data centers, AI accelerators, and HPC servers operate with dense multi-layer interconnects and high-frequency signaling. Signal degradation, thermal hotspots, and impedance drift can severely impact throughput and reliability. Megtron 7 PCB laminates offer low-loss dielectric properties, tight Dk/Df tolerances, and high thermal conductivity, enabling reliable high-speed signal transmission in complex multi-layer...