Comprehensive fabrication guide for Rogers RO4000® series laminates — including RO4003C™, RO4350B™, and RO4835™. Learn about lamination, drilling, plating, and surface finishing for high-frequency RF, microwave, and high-speed PCB manufacturing.
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Explore Rogers low outgassing PCB laminates — RT/duroid®, RO3000®, and RO4000® series — engineered for spacecraft and satellite applications. Discover materials meeting NASA ASTM E595 standards with excellent RF, thermal, and mechanical stability for antennas, payloads, and spaceborne systems.
Explore Rogers RO4000® Series high-frequency laminates including RO4003C™, RO4350B™, and RO4835™. Learn their dielectric properties, thermal performance, fabrication guidelines, and RF applications in antennas, radar, and high-speed digital circuits.
Explore Rogers RO4000® series laminates including RO4003C™ and RO4350B™ for RF, microwave, and high-speed digital circuits. Discover low-loss, high-thermal-reliability PCB materials compatible with standard FR-4 processes, suitable for automotive radar, base station antennas, satellite communications, and high-frequency applications.
Rogers RO4003C, RO4350B, and RO4835 laminates are high-performance ceramic-filled hydrocarbon composites for RF, microwave, and high-speed PCB applications. KKPCB provides expert PCB manufacturing with reliable PTH, multilayer bonding, and outer layer processing.
Learn how to optimize PCB manufacturing using Rogers RO4350B laminates with SP200501 starting point compensation factors. Ensure precise etching, drilling, lamination, and imaging for high-frequency and RF circuit designs. Improve dimensional stability, signal integrity, and reliability in multilayer PCBs.
Discover Rogers RO4360G2™ — a high-Dk RF and microwave laminate with low loss, high thermal conductivity, and FR-4 compatibility for 5G, radar, and aerospace PCBs.
Device Attachment Methods and Wirebonding Notes for RTduroid and RO4000 Series High Frequency Lamina
Learn the best practices for device attachment and wirebonding on RT/duroid RO4000 laminates. This guide covers epoxy and solder attachment, gold and aluminum wire bonding, thermal management, and RF grounding techniques to ensure reliability in high-frequency and microwave PCB applications.
Comprehensive RO4360G2 fabrication guide — drilling, lamination, etching, soldering, and thermal management for high-frequency RF and microwave PCB designs.
Comprehensive RO4360G2 laminate processing guide — covering drilling, lamination, etching, soldering, and thermal management for high-frequency PCB manufacturing.
KKPCB is a leading electronic solutions provider specializing in PCB design, fabrication, assembly, and testing for Flex, Rigid-Flex, RF/Microwave, HDI, rigid multilayer, and ATE test boards. We offer comprehensive end-to-end services, including prototyping, component sourcing, SMT/THT assembly, functional testing, enclosure assembly, and final product packaging. With our one-stop, in-house capabilities, KKPCB delivers OEM and ODM solutions with fast turnaround, high quality, and cost-effective results, serving clients worldwide.
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