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KKPCB Glazed substrates have excellent surface flatness and minimal surface defects, making them ideal for thermal print heads used in fax machines, copiers and various printers. Features A wide range of glaze thicknesses, from 30μm to 200μm. Heat storage and heat dissipation can be controlled by adjusting the glaze thickness. Full-surface glaze or partial-surface glaze designs...

Shenzhen KKPCB Technology Co., Ltd.’s Alumina-Zirconia substrates have high strength and toughness. Their excellent electrical and thermal properties are ideal for applications that require high reliability, such as automotive, industrial machinery, and IGBT power modules. Features KKPCB’s high-strength flexible Alumina-Zirconia substrates have a bending strength that is more than 1.5 times that of standard alumina substrates. The thinnest...

Ceramic PCBs (Ceramic Printed Circuit Boards) are circuit boards that use ceramic materials as substrates, offering excellent thermal management, electrical performance, and mechanical properties. Based on different application requirements and characteristics, ceramic PCBs come in various types, which are outlined below: Single-Layer Ceramic PCB: These are basic ceramic PCBs with a single conductive layer on the...

With the widespread adoption of new energy vehicles, more people are recognizing the excellent performance of ceramic substrates, and the demand for these materials is steadily increasing. Compared to traditional fiberglass boards, ceramic substrates offer superior mechanical strength, high-temperature resistance, and excellent thermal conductivity. In addition, ceramic substrates also exhibit excellent dimensional and chemical stability. However, they...

The Curamik® product suite offers best-in-class metallized ceramic substrates for higher power efficiency. Composed of pure copper bonded or brazed to a ceramic substrate, our curamik® Metallized Ceramic Substrates are designed to carry higher currents, provide higher voltage isolation, and operate over a wide temperature range. curamik Ceramic Substrates The high thermal conductivity, high heat capacity, and...

In the world of electronics, where technological advancements occur rapidly, the multilayer PCB has established its dominance. Over the past few decades, multilayer printed circuit boards have become an indispensable part of modern electronic devices, enabling them to meet the complex needs of today’s consumers. From Single to Double-sided PCB to Multilayer PCB Traditionally, printed circuit boards...

Multilayer Printed Circuit Boards (PCBs) or Multilayer Boards (MLBs) feature more than two copper layers, interconnected using copper-plated holes. These holes may include NC vias, laser microvias, through-holes, buried, or blind vias. The layers consist of copper foil, prepreg (PP), or adhesive materials and are pressed together under high temperature and pressure. This process removes air...

What’s HDI PCB? High-density interconnect (HDI) PCBs are characterized by finer lines, closer spaces, and more dense wiring, which allow for a faster connection while reducing the size and bulk of a project. These boards also feature blind and buried vias, laser ablated microvias, sequential lamination, and via in-pads. As a result, a HDI board can house the functionality of the previous...