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The DiClad® Series Laminates are advanced PTFE-based (Polytetrafluoroethylene) laminates reinforced with woven fiberglass, designed for high-frequency applications such as RF (Radio Frequency), microwave circuits, and high-speed digital designs. These laminates offer excellent electrical performance, low loss, and high reliability, making them ideal for demanding environments in communications, aerospace, and defense industries. Key Features of DiClad® Series Laminates: 1. Material Composition: PTFE Resin: PTFE is chosen for...

The DiClad® 870/880 Series are high-performance PTFE-based laminates designed for High Frequency Laminates and microwave applications, particularly in the RF (Radio Frequency), microwave circuits, and high-speed digital designs. These laminates are engineered to provide low loss, stable dielectric properties, and mechanical strength, making them ideal for use in demanding environments such as telecommunications, aerospace, and defense. Key Features of DiClad® 870/880 Series Laminates: 1. Material Composition: PTFE...

The TC Series High-Frequency Laminates are specifically engineered for microwave, RF, and high-speed digital circuits. They are suitable for microstrip, stripline, and multilayer circuits, which are commonly used in various applications such as telecommunications, aerospace, defense, and electronics. These laminates provide exceptional performance in high-frequency designs, offering low loss, stable dielectric properties, and robust mechanical strength. TC Series High Frequency Laminates Fabrication Guidelines: Proper fabrication of high-frequency laminates is...

The TC600™ Laminates are a high-performance class of high-frequency laminates used for microwave, RF, and high-speed digital circuit applications. These laminates are designed to provide excellent signal integrity, low loss, and high reliability, making them ideal for telecommunications, satellite communications, aerospace, defense, and other advanced electronic applications. TC600™ Laminates Data Sheet Key Features: Material Composition: Base Material: The TC600™ laminates are typically constructed using PTFE (Polytetrafluoroethylene) as the base resin, which is...

The HPL-03015(High Power Lighting)Laminate is specifically designed for high-power lighting applications, with a focus on providing excellent thermal management, high-frequency performance, and mechanical stability. These laminates are particularly suitable for advanced LED lighting systems, power electronics, and other applications requiring superior thermal conductivity and electrical performance. Key Features of HPL-03015(High Power Lighting)Laminates 1. Material Composition: Base Material: Engineered with thermally conductive substrates, ensuring efficient...

The HT-04503 laminate is a high-performance material specifically engineered for applications requiring high thermal resistance, mechanical stability, and reliable electrical performance under extreme operating conditions. These laminates are widely used in aerospace, automotive, power electronics, and industrial electronics where high temperatures are a critical factor. Key Features of HT-04503 Laminates 1. Material Composition High-Temperature Resin System: Specially formulated to withstand extreme thermal environments. Reinforced Fiberglass: Provides...

Thermal Clad® Laminates are engineered solutions for high-performance thermal management in power electronics. They combine excellent heat dissipation with reliable electrical insulation, making them ideal for LED lighting, automotive electronics, power supplies, and industrial applications. This guide provides an overview of Thermal Clad® materials, their properties, and how to select the most suitable material for your application. Key Components of Thermal...

The CS-AL-88-AD2 is a high-performance metal-based laminate engineered for high-power electronics and thermal management applications. It is specifically designed to provide superior heat dissipation, electrical insulation, and mechanical durability for demanding environments. This laminate is ideal for power modules, LED lighting systems, automotive electronics, and industrial electronics. Key Features 1. Material Structure Circuit Layer: Copper foil for circuit formation, with a typical thickness range of 35 μm to 140 μm for high current-carrying...

185HR is a high-performance laminate and prepreg material designed for use in high-reliability printed circuit boards (PCBs). It offers a combination of high glass transition temperature (Tg), excellent thermal stability, and low electrical loss, making it ideal for advanced applications such as high-speed digital circuits, multilayer PCBs, and aerospace electronics. Key Features 1. Material Composition Laminate: Made from advanced epoxy resin systems...

370HR is a high-performance FR-4 epoxy laminate and prepreg system known for its exceptional thermal reliability, mechanical strength, and electrical performance. With a high glass transition temperature (Tg) of 180°C, it is designed for applications requiring excellent performance under thermal and mechanical stress, making it suitable for multilayer PCBs, high-speed digital designs, and aerospace and defense electronics. Key Features 1. Material Composition Laminate: Epoxy resin...