RF-35A2 RF substrate offers ultra-low dielectric loss, high thermal reliability, and mechanical strength, ideal for power amplifiers, 5G systems, and satellite communications.
RF-35A2 RF substrate offers ultra-low dielectric loss, high thermal reliability, and mechanical strength, ideal for power amplifiers, 5G systems, and satellite communications.
Discover Taconic RF-60A, a high-performance, low-moisture-absorption PTFE laminate ideal for RF and microwave PCBs. Stable dielectric constant, low dissipation factor, high thermal reliability, and mechanical strength make it perfect for 5G, aerospace, automotive radar, and satellite communication applications.
Taconic RF-60TC is a high-thermal-conductivity PTFE laminate (1.44 W/m·K) optimized for RF and microwave designs. Featuring low loss (Df ≤ 0.002), stable Dk (6.15), and excellent reliability, it’s ideal for 5G base stations, radar systems, antennas, and aerospace electronics.
Taconic TLY-5 — a low-Dk, low-loss PTFE laminate for aerospace, radar, and satellite communication PCBs. Offers excellent stability, low moisture absorption, and consistent RF performance up to 77 GHz.
Taconic TLY-5 is a high-performance PTFE-based RF laminate engineered for high-frequency and microwave circuits. Featuring a stable dielectric constant (Dk 3.2), low dissipation factor (Df ≤ 0.004), and excellent thermal stability, TLY-5 provides outstanding signal integrity and reliability. Ideal for radar, satellite communication, antennas, filters, and high-speed PCB designs, TLY-5 delivers consistent performance in automotive, aerospace, and telecommunication systems.
Discover Taconic TLY-5A, a premium low-loss PTFE RF laminate with stable dielectric constant (Dk 3.0 ±0.05), low dissipation factor (Df ≤0.003), and excellent thermal stability. Ideal for high-frequency, microwave, 5G, aerospace, and automotive radar PCB applications.
The TRF series (TRF-41, TRF-43, TRF-45) offers low-loss RF and microwave laminates with stable Dk, high thermal reliability, and excellent signal integrity for advanced PCB designs.
TSM-DS3 is a high-performance RF and microwave laminate with low Df, stable Dk, and excellent thermal reliability for high-frequency PCB and RF circuit applications.
ThinFlex-A A-2010RD is a high-performance adhesiveless double-sided copper clad laminate designed for high-frequency, high-speed, and high-temperature PCB applications.
Learn about UL QMTS2.E189572 certification for polymeric materials including filament-wound tubing, industrial laminates, vulcanized fiber, and components used in recognized printed wiring boards. Ensure high-quality, reliable materials for electronic and industrial applications.