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thermal dissipation - KKPCB

High-Density Power Integrity and Heat Dissipation Optimization Using Ceramic PCB Substrates in Laptop Motherboards and Wi-Fi 7 Systems

Engineering Context / Abstract   Modern laptop motherboards and Wi-Fi 7 modules demand exceptional power integrity and efficient thermal management due to the increasing density of integrated circuits, high-speed memory buses, and advanced RF front-end modules. Ceramic PCB substrates, featuring low dielectric loss (Df = 0.0015 @10GHz) and stable dielectric constant (Dk = 9.8 ±...