Semiconductor Packaging PCB - KKPCB
 
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Semiconductor Packaging PCB - KKPCB

BT Epoxy PCB Design for High-Reliability IC Packaging and High-Density Interconnect Applications

A BT Epoxy PCB is a material system specifically developed to meet the demands of semiconductor packaging, IC substrates, and high-density interconnect structures. Unlike general-purpose FR-4, BT epoxy resin is engineered for environments where thermal stability, dimensional control, and long-term reliability are non-negotiable design constraints. Material Characteristics of BT Epoxy PCB BT epoxy, derived from...

BT Epoxy PCB Design for Dimensional Stability and Electrical Reliability in IC Packaging Applications

A BT Epoxy PCB is a specialized organic substrate widely used in IC packaging, semiconductor interposers, and high-density electronic modules. BT (Bismaleimide Triazine) epoxy resin materials are engineered to provide enhanced thermal stability, low moisture absorption, and excellent dimensional control, making BT Epoxy PCBs a preferred choice for fine-pitch and high-I/O-count packaging environments. Unlike standard...