The XtremeSpeed™ RO1200™ Bondply from Rogers Corporation offers ultra-low dielectric loss, excellent thermal stability, and mechanical reliability for high-speed digital applications, including HPC servers, backplanes, and automated test equipment.
The XtremeSpeed™ RO1200™ Bondply from Rogers Corporation offers ultra-low dielectric loss, excellent thermal stability, and mechanical reliability for high-speed digital applications, including HPC servers, backplanes, and automated test equipment.