RF PCB manufacturing - KKPCB
 
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RF PCB manufacturing - KKPCB

Hybrid Stackup Integration and Impedance Control of RF-35 PCBs for Automotive mmWave Radar Sensors

Engineering Context — Why RF-35 PCB Is Key to Automotive Radar Precision   As modern automotive radar systems evolve toward 76–81 GHz mmWave operation, PCB materials must ensure phase stability, low insertion loss, and precise impedance control across multiple layers.The RF-35 PCB, a Taconic PTFE glass-reinforced laminate, combines Df = 0.0018 @ 10 GHz and...

Understanding RO4835 PCB: High Thermal Stability and Low Loss Material for 5G & Radar Applications

How Rogers RO4835 Material Enables Stable RF Performance in Harsh Environments The Growing Demand for Thermally Stable, Low-Loss PCBs   As 5G networks, automotive radar, and satellite communications evolve toward millimeter-wave frequencies (24–77 GHz), PCB materials face increasing performance pressure.Engineers now require substrates that maintain low insertion loss, tight dielectric control, and thermal stability under...

RO4350B PCB Hybrid Stackup Design and Lamination Challenges in Mass Production

Engineering Reliable RF Performance with KKPCB’s Hybrid Lamination Expertise   As 5G and radar systems advance toward higher frequencies (24–77 GHz) and more compact multilayer designs, engineers increasingly choose Rogers RO4350B PCB for its stable dielectric properties, low loss, and compatibility with standard FR-4 processes.   Yet, when moving to hybrid stackups—mixing RO4350B with FR-4,...

How RO4350B PCB Powers Next-Generation 5G Antenna Array Modules

Building the Backbone of 5G Antenna Performance with RO4350B PCB As 5G networks evolve toward higher frequencies (sub-6 GHz → mmWave) and denser integration, PCB performance has become a decisive factor in antenna module design.Engineers must now balance low insertion loss, thermal stability, and mass-production manufacturability—a challenge only a few materials can meet. That’s why...

Lamination Process Tips for PTFE-Based High Frequency PCBs

1. Introduction In the field of high-frequency PCB manufacturing, PTFE-based materials such as Rogers RO3003 and RO4350B are widely used for their low dielectric loss and stable electrical performance.However, the lamination process for PTFE-based high frequency PCBs is more complex than standard FR4 due to PTFE’s unique mechanical and chemical properties.This article summarizes key lamination...