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multilayer satellite design - KKPCB

Optimize Thermal Reliability Using High-Density Satellite PCB Stackups in Next-Generation LEO Constellation Terminals

LEO constellation terminals—whether phased-array user antennas, gateway stations, or compact mobile terminals—are being pushed toward wideband RF performance, higher transmit power, and increasingly integrated architectures.This raises a persistent engineering challenge: how to maintain thermal reliability inside a multilayer high-density PCB where RF, digital, and power systems coexist in tight proximity. At orbital altitudes, temperature swings...