high-speed module design - KKPCB
 
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high-speed module design - KKPCB

Maximize RF Power Handling and Dielectric Reliability Through TLY-5 PCB Engineering for Next-Gen High-Speed Modules

TLY-5 PCB laminates occupy a critical space in modern high-frequency design, where RF power density, dielectric stability, and consistent impedance performance determine the reliability of next-generation wireless modules. As high-speed systems extend beyond 20–40 GHz into true mmWave architecture, the engineering of TLY-5 PCB stackups becomes essential for maintaining ultra-low loss, stable dielectric constant (Dk),...