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high-power RF routing - KKPCB

Optimize Thermal Reliability Using High-Density Satellite PCB Stackups in Next-Generation LEO Constellation Terminals

LEO constellation terminals—whether phased-array user antennas, gateway stations, or compact mobile terminals—are being pushed toward wideband RF performance, higher transmit power, and increasingly integrated architectures.This raises a persistent engineering challenge: how to maintain thermal reliability inside a multilayer high-density PCB where RF, digital, and power systems coexist in tight proximity. At orbital altitudes, temperature swings...

Precision Impedance Control and Low-Loss High-Frequency Routing Using RO5880 PCB for Advanced Radar and 5G Modules

High-frequency radar and 5G modules demand precise impedance control, low insertion loss, and phase-stable signal propagation across dense multilayer architectures. Any deviation in Dk/Df, surface roughness, or stackup alignment can lead to signal distortion, beam misalignment, and reduced link margin. RO5880 PCB laminates (Dk = 2.2 ± 0.02, Df = 0.0009 @10 GHz) provide ultra-low...