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How RO4350B PCB Powers Next-Generation 5G Antenna Array Modules

Building the Backbone of 5G Antenna Performance with RO4350B PCB As 5G networks evolve toward higher frequencies (sub-6 GHz → mmWave) and denser integration, PCB performance has become a decisive factor in antenna module design.Engineers must now balance low insertion loss, thermal stability, and mass-production manufacturability—a challenge only a few materials can meet. That’s why...

RO4350B PCB in 77GHz Automotive Radar: From Design Challenges to Mass Production

1. Introduction As the automotive industry races toward higher levels of autonomy, 77 GHz radar systems have become the backbone of advanced driver-assistance systems (ADAS).At these millimeter-wave frequencies, PCB material stability directly defines radar accuracy, signal phase consistency, and long-term reliability. Among all high-frequency laminates, Rogers RO4350B PCB has emerged as a proven and cost-effective...

RO4003C™ Laminates — High-Performance, Cost-Effective PCB Material by KKPCB

At KKPCB, we specialize in advanced PCB manufacturing for RF, microwave, and high-speed digital applications, where performance, consistency, and manufacturability are paramount. Among the wide range of high-frequency materials we process, Rogers RO4003C™ laminates stand out as one of the most balanced solutions — combining excellent electrical performance, mechanical stability, and cost-effectiveness. Exceptional Material Composition...

IoT PCB Design Solutions by KKPCB — Overcoming Challenges in Compact and High-Performance Board Manufacturing

PCB Design for IoT Devices — Challenges and KKPCB Solutions for Compact, Efficient Boards As the Internet of Things (IoT) reshapes industries—from consumer electronics and healthcare to agriculture—printed circuit boards (PCBs) play a central role in enabling intelligent connectivity. Designing PCBs for IoT devices requires precision, innovation, and balance: compact size, power efficiency, signal integrity,...

Low-Loss PCB Materials: High-Frequency Solutions for Next-Generation Electronics

Introduction to Commonly Used Low-Loss PCB Materials As high-frequency and high-speed electronic designs become increasingly dominant, low-loss PCBs have become the cornerstone of reliable RF, microwave, and high-speed digital systems. These circuit boards are engineered to minimize signal attenuation, power loss, and distortion, ensuring stable performance even at gigahertz-level frequencies. At KKPCB, we specialize in...

Lamination Process Tips for PTFE-Based High Frequency PCBs

1. Introduction In the field of high-frequency PCB manufacturing, PTFE-based materials such as Rogers RO3003 and RO4350B are widely used for their low dielectric loss and stable electrical performance.However, the lamination process for PTFE-based high frequency PCBs is more complex than standard FR4 due to PTFE’s unique mechanical and chemical properties.This article summarizes key lamination...

RO3003 vs RO4350B: Which Rogers Material Is Better for 24GHz Applications?

1. Introduction As radar and wireless communication move into the 24GHz spectrum, selecting the right high-frequency PCB material becomes one of the most critical design decisions.Among the top contenders, Rogers RO3003 and RO4350B stand out for their reliable electrical performance and widespread industrial use. At KKPCB, our engineering team has extensive experience fabricating both RO3003...

RO3003 PCB Material Overview and Its Key Electrical Properties

1. KKPCB Rogers RO3003 Introduction Rogers RO3003 is a high-frequency PCB laminate engineered for applications demanding stable electrical performance, low loss, and excellent thermal reliability.It belongs to the Rogers RO3000™ Series, widely used in automotive radar, 5G modules, satellite communication, and RF front-end systems. Unlike conventional FR4, which shows high dielectric variation and loss at...

Blind and Buried Vias in PCB Design – Advanced HDI Interconnection Solutions

Blind and Buried Vias in PCB Design — Structure, Function, and Manufacturing Insights As the miniaturization of electronic components continues to accelerate, PCB designs must accommodate finer pitch components and higher circuit densities, especially in advanced mobile, communication, and computing applications. One of the critical technologies enabling this evolution is the use of blind and...