Nelco N4000-13 offers high Tg (210°C), low Dk (3.2), and low Df (0.008), ideal for high-speed PCBs, backplanes, and communication systems requiring superior performance.
Nelco N4000-13 offers high Tg (210°C), low Dk (3.2), and low Df (0.008), ideal for high-speed PCBs, backplanes, and communication systems requiring superior performance.
N4800-20 is a high-speed, low-loss epoxy laminate from AGC Multi Material America, designed for advanced multilayer PCBs. With Tg 210°C, Dk 3.6, and Df 0.007, it ensures excellent signal integrity, CAF resistance, and thermal stability for high-speed networking, routers, and 5G communication systems.
Rogers 92ML is a halogen-free, thermally conductive epoxy laminate and prepreg with 2.0 W/m·K thermal conductivity and Tg 160°C. Ideal for high-power electronics, LED lighting, and automotive systems requiring superior heat dissipation and reliability.
Explore how soldering temperature affects copper adhesion and reliability of RT-duroid 5870 high-frequency PCBs. Optimize your RF PCB soldering process.
Explore RT-duroid 5870 and 5880 microwave laminates with proven cryogenic performance, low loss, and dimensional stability for high-frequency NASA and space applications.
Learn how to calculate stripline line widths for RT-duroid laminates. Optimize Z₀, impedance matching, and signal integrity for high-frequency RF, microwave, 5G, and aerospace PCB applications.
Explore Rogers low-outgassing laminates, including RT-duroid 5870 and 5880, ideal for space electronics, vacuum systems, and precision instruments. Low TML/CVCM, stable electrical performance, and high reliability for aerospace and high-frequency applications.
Discover RT-duroid 5870 PTFE-based laminates with low dielectric constant, ultra-low loss tangent, and excellent thermal stability for RF, microwave, and aerospace applications.
RT/duroid 5870 and 5880 laminates offer stable Dk, low dielectric loss, and excellent mechanical properties for high-frequency, RF, and microwave PCB applications.
RT-duroid laminates offer ultra-low dielectric loss, stable Dk, and high thermal stability for RF, microwave, and high-frequency PCB applications in aerospace, defense, and telecom.