1. Engineering Context Next-generation mmWave communication systems—including 5G base stations, satellite payloads, and radar modules—require PCBs that provide ultra-stable impedance, low insertion loss, and phase-consistent routing. Traditional FR-4 or high-speed laminates often suffer from dielectric drift, higher Df, and thermal expansion issues, which degrade signal fidelity, EMI immunity, and system reliability in dense multi-layer RF...











