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PSIS – RO1200 Laminate Series

RO1200 laminates from Rogers’ XtremeSpeed™ series deliver ultra-low loss, stable dielectric performance, and excellent thermal and mechanical reliability. Ideal for high-frequency applications in 5G, aerospace, defense, and high-speed digital circuits.

RO1200 Bondply Data Sheet

The XtremeSpeed™ RO1200™ Bondply from Rogers Corporation offers ultra-low dielectric loss, excellent thermal stability, and mechanical reliability for high-speed digital applications, including HPC servers, backplanes, and automated test equipment.

XtremeSpeed™ RO1200™ Series Circuit Materials

Explore Rogers XtremeSpeed™ RO1200™ laminates, engineered for high-speed digital and RF PCBs. Ultra-low loss, ceramic-filled PTFE with woven-glass reinforcement ensures exceptional signal integrity, mechanical stability, and manufacturability. Ideal for telecom, aerospace, and high-performance computing.

RO4000 Series High-Frequency Circuit Materials

Discover RO4000 Series hydrocarbon ceramic laminates for superior high-frequency PCB performance. Ideal for RF, microwave, millimeter-wave, and high-speed digital applications, these low-loss, cost-effective laminates ensure dimensional stability, reliable plated-through holes, and compatibility with standard FR-4 processes. Perfect for telecommunications, automotive radar, aerospace, and industrial IoT devices.

Temperature Rise Estimations in Rogers High Frequency Circuit Boards Carrying Direct or RF Current

Learn how to accurately estimate and manage temperature rise in high-frequency circuit boards using Rogers laminates such as RO4000®, RO3000®, and RT/duroid®. This guide covers DC and RF heating, thermal properties, trace design considerations, mitigation strategies, and verification methods to ensure reliable performance in telecommunications, aerospace, and defense applications.