KKPCB Blog – PCB & PCBA Insights, News, and Tips - KKPCB
 

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Explore the KKPCB Blog for the latest PCB manufacturing and assembly news, industry insights, expert tips, and technology trends, helping you stay informed and optimize your electronics projects.
SMT Soldering Process and Assembly Technology

SMT soldering process and technology are slightly different from through-hole technology. SMD soldering or surface mount technology assembly requires different SMT equipment and more experience and expertise. SMT PCBs have flat tin-lead or gold-plated copper pads without any holes. These traces are called “pads”. SMT Soldering Process Semi-solid solder called solder paste, which consists of very fine...

How to Solder Electronic Components

Basic soldering guide on how to solder electronic components to a printed circuit board (PCB). This is a detailed and complete soldering guide for both automated soldering in mass production and manual soldering in PCB rework and repair. How to Solder Electronic Components – Introduction Soldering is basically a technique of joining two metals using a...

SMT vs Thru-Hole Manufacturing

At the heart of nearly every electronic product today is a printed circuit board (PCB), which supports and electrically connects the electronic components needed for an electronic device to function. Manufacturing a printed circuit board is a complex process that involves many steps that are different for every project. First, you need to design the board...

Best Ways to Use Skip Vias in HDI PCBs

Designing via stackups is one of the most critical aspects of HDI PCB design. Vias in HDI PCBs offer greater flexibility compared to standard boards, but they also significantly impact manufacturing costs and reliability. The choice of via style is crucial for enabling dense routing while avoiding potential failure points in the final assembly. For designs...

High-Frequency PCB Assembly Case Study: High-Precision Communication Equipment

Customer Background: Our customer is a leading communication equipment company specializing in the development and manufacturing of high-frequency devices for 5G communication systems. Due to the high-frequency signal transmission requirements of their products, their PCB design demands extremely high signal integrity and strong anti-interference capabilities. Product Complexity: The primary challenge of this project was ensuring that the high-frequency...

Copper Current Density in PCB Design

Copper current density refers to the amount of continuous current going through a copper wire —whether on a circuit board as a trace or not. According to the principles of Joule or Ohmic heating (represented as VI or I²R), any material that conducts electricity will generate heat, leading to a gradual rise in temperature in...

Low Power Circuit Design Strategies for PCBs

Low power circuit design includes strategies focused on minimizing both dynamic and static power usage in your printed circuit boards. While selecting components with low power requirements is a crucial element, low power PCB design involves more comprehensive considerations to effectively manage power consumption. Lower Power Circuit Designs Tips Aspect Description Identify Major Power Consumers Start by...

Through-Hole Pad Design: Enhancing PCB Durability and Reliability

In printed circuit board (PCB) design, the choice of pad type plays a critical role in determining the durability, reliability, and performance of the final product. Through-hole pads, which are designed for components with leads that pass through the PCB, offer superior mechanical and electrical connections compared to surface mount pads. This article explores the design steps for...

Through-Hole Pad Design for PCB Durability

In printed circuit board (PCB) design, copper pads are points for attaching components with soldering. These pads come in two primary types: through-hole and surface-mount (SMD). Through-hole pads are designed for components with leads that are inserted through the pad’s holes and soldered on the opposite side of the board. This method ensures a mechanical and electrical bond between...