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PCBs operating at high power also tend to operate at high temperature, sometimes cycling between high and low temperatures repeatedly. Sometimes, a PCB will operate in a high ambient temperature environment, and the board needs to remove heat from components to prevent even higher temperatures from being reached in the system. Active cooling measures are...

Manual soldering, while not as precise as automated assembly processes like reflow soldering, is still widely used in various applications. However, it is prone to specific defects that can affect the quality and reliability of the final product. Understanding these common manual PCB soldering defects is crucial for maintaining high product quality and yield. Common Manual PCB Soldering...

Aball grid array (BGA) is a type of surface-mount packaging that features an array of small solder balls on the underside, which serve as electrical connections to the printed circuit board (PCB). Unlike dual in-line or flat packages, ball grid arrays offer the advantage of accommodating a greater number of interconnection pins, made possible by utilizing the entire bottom...

PCB edge plating is a specialized process that involves applying a metal coating to the exposed copper connections at the edge of a printed circuit board (PCB). This technique, also known as side plating, battlement, or metallized edge plating, enhances electrical connectivity, structural rigidity, and electromagnetic interference (EMI) shielding. This article provides an in-depth look at the...

Take a look at any type of multiconductor serial bus that uses single ended traces. You’ll probably see some resistors sitting around the bus being connected to driver pins and power or ground. The use of these resistors is intentional with the purpose being to set the signal level and reflection control on the bus....

Chip-Scale Package (CSP) is a type of integrated circuit packaging technology. The size of the package is up to 1.2 times the size of the actual die, with only a single-die and a direct surface mountable package. First originating in the 1990s, it was developed as a response to the demand for smaller and more efficient...

Electronics are becoming faster, smaller, and used in more demanding environments. Miniaturized ICs and SMDs operate at higher frequencies and require more power. Increased current demands cause voltage drops across resistive elements, generating heat and leading to temperature rises and hotspots. Over half of electronic component failures now stem from heat-related stress. To develop high-quality circuit...

PCB tolerances for manufacturing refer to the allowable variations from specified dimensions, encompassing: material thickness, copper thickness, drilling, plating, and solder masks. These PCB tolerances ensure that PCB circuit boards are produced precisely and can function as intended. Manufacturers adhere to specific in-house tolerance guidelines, based on international standards like IPC-A-600 Class 2, to maintain quality throughout the...

Smart Water-Saving Irrigation Control System Solution Background Overview With the increasing global water scarcity, especially in large-scale agricultural planting areas, traditional irrigation methods face issues such as water waste, cumbersome manual operations, and imprecise irrigation control. To address these pain points, we have helped our customers develop a wireless smart irrigation controller PCBA. This controller utilizes...