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Hybrid Stackup Design Using Duroid 6010 PCB for High-Density RF and Microwave Packaging

The Challenge — Miniaturization vs. RF Integrity   In the race toward smaller, lighter, and more integrated microwave systems, engineers face an unavoidable trade-off: how to pack more functionality—LNAs, filters, phase shifters, power amplifiers—into limited PCB real estate without compromising signal integrity or dielectric stability.   Rogers Duroid 6010, with its high dielectric constant (Dk...