thermal reliability test - KKPCB
 
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thermal reliability test - KKPCB

Thermal Management and Dimensional Stability of RO4003C PCBs in High-Power RF Designs

1. The Growing Thermal Challenge in High-Power RF & mmWave Systems   As 5G infrastructure, satellite communication, and automotive radar systems push beyond 24–81 GHz, PCB substrates face new levels of thermal density and mechanical stress.  In these high-frequency environments, heat is not just a byproduct — it’s a design-defining variable that directly influences signal...