1. Engineering Overview — Power and EMI Challenges in High-Speed Computing Boards As laptops and enterprise servers transition to PCIe 5.0/6.0 and DDR5 architectures, maintaining power integrity (PI) and electromagnetic interference (EMI) control becomes a core constraint in multilayer PCB design. The TLY-5 PCB, with its ultra-low Dk (2.20 ± 0.02) and low Df...


