Achieving High-Frequency Reliability and Efficient Heat Dissipation Through KKPCB’s Hybrid Lamination Platform From Material Performance to System-Level Efficiency In industrial mmWave transceiver modules operating from 28 to 81 GHz, engineers face a dual challenge: maintaining signal integrity across multilayer stackups while managing localized power density and heat accumulation.Traditional FR-4 or mid-grade PTFE composites...



