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How RO4350B PCB Powers Next-Generation 5G Antenna Array Modules

Building the Backbone of 5G Antenna Performance with RO4350B PCB As 5G networks evolve toward higher frequencies (sub-6 GHz → mmWave) and denser integration, PCB performance has become a decisive factor in antenna module design.Engineers must now balance low insertion loss, thermal stability, and mass-production manufacturability—a challenge only a few materials can meet. That’s why...

Lamination Process Tips for PTFE-Based High Frequency PCBs

1. Introduction In the field of high-frequency PCB manufacturing, PTFE-based materials such as Rogers RO3003 and RO4350B are widely used for their low dielectric loss and stable electrical performance.However, the lamination process for PTFE-based high frequency PCBs is more complex than standard FR4 due to PTFE’s unique mechanical and chemical properties.This article summarizes key lamination...