RF heat dissipation - KKPCB
 
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RF heat dissipation - KKPCB

Thermal Management Strategies for RO4835 PCBs in High-Power RF and mmWave Designs

Heat Dissipation Challenges in High-Power RF Circuits   As RF and mmWave systems scale beyond 24 GHz, power density and thermal stress become critical limiting factors for system reliability. Engineers designing automotive radar front-ends, 5G transceivers, and satellite payloads must manage high localized temperatures within densely packed multilayer PCBs.   While traditional FR-4 substrates often...