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power density - KKPCB

Improving Power Density and EMI Suppression with Ceramic PCB Substrates in High-Performance Laptop and Server Systems

1. Engineering Overview   As laptop and server architectures evolve toward higher clock rates and denser power delivery networks, PCB substrates must withstand increasing thermal stress and EMI coupling.  Ceramic PCB materials, with their excellent dielectric stability and superior thermal conductivity (>20 W/m·K), provide a robust platform for managing power transients and high-frequency switching noise...

Hybrid Stackup Integration and Power Density Enhancement Using Duroid 6002 PCBs in Industrial mmWave Transceivers

Achieving High-Frequency Reliability and Efficient Heat Dissipation Through KKPCB’s Hybrid Lamination Platform   From Material Performance to System-Level Efficiency   In industrial mmWave transceiver modules operating from 28 to 81 GHz, engineers face a dual challenge: maintaining signal integrity across multilayer stackups while managing localized power density and heat accumulation.Traditional FR-4 or mid-grade PTFE composites...