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Improving Power Density and EMI Suppression with Ceramic PCB Substrates in High-Performance Laptop and Server Systems

1. Engineering Overview   As laptop and server architectures evolve toward higher clock rates and denser power delivery networks, PCB substrates must withstand increasing thermal stress and EMI coupling.  Ceramic PCB materials, with their excellent dielectric stability and superior thermal conductivity (>20 W/m·K), provide a robust platform for managing power transients and high-frequency switching noise...

Ptimizing Power Delivery and EMI Suppression with TLY-5 PCB Substrates in High-Speed Laptop and Server Motherboards

1. Engineering Overview — Power and EMI Challenges in High-Speed Computing Boards   As laptops and enterprise servers transition to PCIe 5.0/6.0 and DDR5 architectures, maintaining power integrity (PI) and electromagnetic interference (EMI) control becomes a core constraint in multilayer PCB design.  The TLY-5 PCB, with its ultra-low Dk (2.20 ± 0.02) and low Df...