Engineering Context / Abstract Modern laptop motherboards and Wi-Fi 7 modules demand exceptional power integrity and efficient thermal management due to the increasing density of integrated circuits, high-speed memory buses, and advanced RF front-end modules. Ceramic PCB substrates, featuring low dielectric loss (Df = 0.0015 @10GHz) and stable dielectric constant (Dk = 9.8 ±...
1. Engineering Overview As laptop and server architectures evolve toward higher clock rates and denser power delivery networks, PCB substrates must withstand increasing thermal stress and EMI coupling. Ceramic PCB materials, with their excellent dielectric stability and superior thermal conductivity (>20 W/m·K), provide a robust platform for managing power transients and high-frequency switching noise...
1. Engineering Overview — Power and EMI Challenges in High-Speed Computing Boards As laptops and enterprise servers transition to PCIe 5.0/6.0 and DDR5 architectures, maintaining power integrity (PI) and electromagnetic interference (EMI) control becomes a core constraint in multilayer PCB design. The TLY-5 PCB, with its ultra-low Dk (2.20 ± 0.02) and low Df...
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