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lamination process - KKPCB

RO4350B PCB Hybrid Stackup Design and Lamination Challenges in Mass Production

Engineering Reliable RF Performance with KKPCB’s Hybrid Lamination Expertise   As 5G and radar systems advance toward higher frequencies (24–77 GHz) and more compact multilayer designs, engineers increasingly choose Rogers RO4350B PCB for its stable dielectric properties, low loss, and compatibility with standard FR-4 processes.   Yet, when moving to hybrid stackups—mixing RO4350B with FR-4,...