hybrid stackup design - KKPCB
 
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hybrid stackup design - KKPCB

Hybrid Stackup Integration and Power Density Enhancement Using Duroid 6002 PCBs in Industrial mmWave Transceivers

Achieving High-Frequency Reliability and Efficient Heat Dissipation Through KKPCB’s Hybrid Lamination Platform   From Material Performance to System-Level Efficiency   In industrial mmWave transceiver modules operating from 28 to 81 GHz, engineers face a dual challenge: maintaining signal integrity across multilayer stackups while managing localized power density and heat accumulation.Traditional FR-4 or mid-grade PTFE composites...