Engineering Context / Abstract Modern laptop motherboards and Wi-Fi 7 modules demand exceptional power integrity and efficient thermal management due to the increasing density of integrated circuits, high-speed memory buses, and advanced RF front-end modules. Ceramic PCB substrates, featuring low dielectric loss (Df = 0.0015 @10GHz) and stable dielectric constant (Dk = 9.8 ±...
1. Engineering Overview Next-generation 5G base stations require high-density, miniaturized RF front-end modules with low insertion loss, precise impedance, and stable phase performance across mmWave bands (28–39 GHz). PTFE PCB laminates, with Dk = 2.15 ± 0.02 and Df = 0.0009 @10GHz, provide superior dielectric consistency and thermal stability for tightly packed MIMO...
1. Engineering Overview Modern aerospace RF communication equipment, including satellite transceivers and spaceborne antenna modules, demands ultra-low-loss PTFE PCBs with tight dielectric uniformity and precise manufacturing tolerances. Small variations in Dk or CTE can lead to phase drift, impedance mismatch, and degraded link margin in Ku/Ka-band RF payloads. PTFE PCB laminates, with Dk...
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