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Aerospace PCB Materials - KKPCB

Optimize Thermal Reliability Using High-Density Satellite PCB Stackups in Next-Generation LEO Constellation Terminals

LEO constellation terminals—whether phased-array user antennas, gateway stations, or compact mobile terminals—are being pushed toward wideband RF performance, higher transmit power, and increasingly integrated architectures.This raises a persistent engineering challenge: how to maintain thermal reliability inside a multilayer high-density PCB where RF, digital, and power systems coexist in tight proximity. At orbital altitudes, temperature swings...

Elevate Signal Integrity with Low-Loss Satellite PCB Architectures for Spaceborne RF Payloads

The shift toward high-throughput satellites, beam-steerable phased arrays, and broadband constellations has transformed how engineers design the satellite PCB at the core of every RF payload. In orbit, a PCB cannot rely on airflow, enclosure shielding, or serviceability. The board must deliver low-loss RF routing, stable dielectric behavior, and consistent electrical performance throughout years of...