RO4350B PCB – Low Loss High Frequency PCB for RF, Microwave and 5G Applications

What Is RO4350B PCB?

A RO4350B PCB is a high frequency printed circuit board manufactured using Rogers RO4350B laminate, a hydrocarbon ceramic-filled material specifically engineered for RF, microwave, and high speed communication applications.

RO4350B PCB is widely used where low signal loss, stable dielectric performance, and precise impedance control are critical. Compared with conventional FR-4 PCB materials, RO4350B PCB offers significantly lower dielectric loss and more predictable electrical behavior at GHz frequencies.

Electrical Properties of RO4350B Material

The performance of a RO4350B PCB is driven by the electrical stability of Rogers RO4350B laminate.

Typical characteristics include:

• Dielectric Constant (Dk): ~3.48 ± 0.05

• Dissipation Factor (Df): ~0.0037 at 10 GHz

• Low Z-axis thermal expansion

• High glass transition temperature (TG > 280°C)

• Excellent dimensional stability

These properties make RO4350B PCB highly suitable for RF transmission lines, antenna structures, and microwave circuits.

Advantages of RO4350B PCB

1. Low Loss Performance

RO4350B PCB minimizes insertion loss in high frequency circuits. This ensures:

• Stronger signal transmission

• Reduced attenuation

• Improved RF efficiency

• Better power amplifier performance

Low loss performance makes RO4350B PCB ideal for 5G modules, radar systems, and microwave communication devices.

2. Stable Dielectric Constant for Impedance Control

The stable Dk of RO4350B laminate enables accurate controlled impedance PCB design. Engineers can reliably design:

• 50Ω microstrip lines

• 50Ω stripline structures

• Differential impedance routing

• High speed signal layers

This consistency ensures repeatable production results.

3. Excellent Thermal Reliability

RO4350B PCB provides:

• Low coefficient of thermal expansion (CTE)

• Strong copper adhesion

• Reduced warpage risk

• Stable multilayer lamination performance

These features improve long-term reliability in harsh operating environments.

4. Easier Processing Compared to PTFE Materials

Unlike PTFE-based laminates, RO4350B PCB:

• Does not require sodium etching

• Is compatible with standard FR-4 processing methods

• Offers higher fabrication yield

• Reduces manufacturing complexity

This balance between performance and manufacturability makes RO4350B PCB highly cost-effective for RF applications.

RO4350B PCB Applications

RO4350B PCB is widely used in:

• RF power amplifier PCB

• 5G base station PCB

• Microwave circuit PCB

• Automotive radar PCB

• Satellite communication PCB

• High frequency test PCB

• Antenna feed network PCB

• mmWave communication modules

It is particularly suitable for designs operating from 1 GHz to multi-GHz frequency ranges.

Hybrid RO4350B PCB Stack-Up

To optimize cost and performance, many designs use hybrid structures combining:

• RO4350B for RF layers

• FR-4 for digital or control layers

Hybrid RO4350B PCB stack-ups allow engineers to achieve low loss RF performance while maintaining overall cost efficiency.

RO4350B PCB vs FR-4 PCB

For high frequency and RF applications, RO4350B PCB is significantly superior to standard FR-4 PCB.

Manufacturing Considerations for RO4350B PCB

Producing a reliable requires:

• Precise impedance modeling

• Tight dielectric thickness control

• Controlled lamination pressure

• Accurate copper surface treatment

• Strict quality inspection

An experienced high frequency PCB manufacturer ensures consistent electrical performance and stable production yield.

Conclusion

RO4350B PCB offers an excellent balance of low loss performance, thermal stability, and manufacturing efficiency. It is a preferred material choice for RF, microwave, 5G, and radar applications requiring stable impedance control and high signal integrity.

Selecting a professional  manufacturer ensures optimized stack-up design, precise fabrication, and reliable long-term performance in demanding high frequency systems.