At KKPCB, we specialize in advanced PCB manufacturing for RF, microwave, and high-speed digital applications, where performance, consistency, and manufacturability are paramount. Among the wide range of high-frequency materials we process, Rogers RO4003C™ laminates stand out as one of the most balanced solutions — combining excellent electrical performance, mechanical stability, and cost-effectiveness.
Exceptional Material Composition for Reliable Performance
RO4003C™ is a woven glass-reinforced hydrocarbon/ceramic composite laminate, developed to bridge the gap between traditional PTFE-based microwave materials and standard epoxy/glass laminates (FR-4).
This unique composition provides:
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The electrical characteristics of PTFE/glass materials — ideal for maintaining low signal loss and consistent dielectric properties at high frequencies.
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The ease of processing and cost advantages of epoxy/glass, allowing it to be fabricated with conventional FR-4 processes without the need for special handling or drilling methods.
The result is a laminate that offers excellent repeatability, reliable impedance control, and tight Dk tolerance, even across complex multilayer structures.
Tight Control of Electrical Parameters
RO4003C™ provides a dielectric constant (Dk) of 3.38 ± 0.05, tightly controlled across both 1080 and 1674 glass fabric styles. Its low dissipation factor (Df) of 0.0027 at 10 GHz ensures minimal signal loss, making it an excellent choice for high-frequency and microwave circuits, including antenna systems, filters, and power amplifiers.
Such characteristics allow engineers to achieve high-speed signal transmission with low phase distortion, critical for today’s data-driven and communication-intensive systems.
Superior Manufacturability with FR-4 Compatibility
Unlike PTFE-based microwave laminates that require special through-hole treatments, plasma desmearing, or chemical conditioning, RO4003C™ can be processed using standard epoxy/glass PCB manufacturing methods.
This FR-4 compatibility provides a clear cost advantage — reducing production complexity, improving throughput, and enabling hybrid stack-ups that combine RO4003C™ layers with FR-4 cores for optimized performance-to-cost ratios.
At KKPCB, our precision lamination and controlled impedance manufacturing processes ensure that the electrical and mechanical integrity of RO4003C™ PCBs remains stable, even for dense multilayer and mixed-signal architectures.
Thermal and Mechanical Stability
The Z-axis coefficient of thermal expansion (CTE) of RO4003C™ is only 46 ppm/°C, ensuring excellent dimensional stability and reliable plated-through-hole integrity, even under temperature cycling.
This property is especially beneficial in RF power amplifiers, automotive radar, and satellite communication modules, where thermal consistency directly impacts electrical performance and long-term reliability.
Additionally, RO4003C™’s low moisture absorption enhances its environmental stability, maintaining electrical parameters in humid or variable climates — an essential factor for outdoor or aerospace systems.
Material Options and Configuration Flexibility
RO4003C™ is available in various thicknesses and copper cladding options, including:
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1080 and 1674 glass fabric styles, each meeting the same dielectric specifications.
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Copper foils from standard ½ oz to heavy 2 oz weights.
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Core thicknesses ranging from 0.2 mm to 3.2 mm, suitable for both single-layer and multilayer configurations.
This flexibility allows KKPCB engineers to tailor stack-up designs precisely to each customer’s electrical, mechanical, and cost requirements.
Flame Retardancy and Alternative Options
RO4003C™ is non-brominated and not UL 94 V-0 rated, as its chemistry focuses on performance rather than flame retardancy.
For applications requiring UL 94 V-0 compliance, KKPCB also offers:
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Rogers RO4350B™ — for similar Dk and improved flammability resistance.
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Rogers RO4835™ — with enhanced oxidation stability for long-term reliability in harsh environments.
Our engineering team assists in material selection based on design goals, certification needs, and cost considerations.
Applications of RO4003C™ PCBs
KKPCB manufactures RO4003C™-based PCBs for a wide range of high-frequency and performance-sensitive products, including:
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5G communication modules
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Radar and satellite systems
Our production expertise ensures precise impedance control, low insertion loss, and consistent dielectric performance — essential for these critical applications.
KKPCB Expertise in High-Frequency PCB Fabrication
As a trusted global PCB manufacturer, KKPCB provides end-to-end engineering and production solutions for high-frequency designs.
From material consultation and stack-up optimization to DFM (Design for Manufacturability) and mass production, our team ensures every board achieves the highest level of electrical precision and mechanical reliability.
Our facilities support:
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Hybrid multilayer builds with mixed materials (RO4003C™ + FR-4)
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Controlled impedance manufacturing
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Tight-tolerance laser drilling and edge plating
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Automated optical inspection and impedance verification
With KKPCB’s process control and engineering depth, customers benefit from faster time-to-market, consistent quality, and optimized cost-performance ratios for every project.
Technical Highlights
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Dielectric Constant (Dk): 3.38 ± 0.05
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Dissipation Factor (Df): 0.0027 @ 10 GHz
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Z-axis CTE: 46 ppm/°C
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Moisture Absorption: 0.06%
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Thermal Conductivity: 0.64 W/m·K
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Max Operating Temperature: 150°C
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UL Rating: Non-brominated (not UL 94 V-0)
Summary
Rogers RO4003C™ laminates represent a perfect balance between high-frequency performance and manufacturability.
At KKPCB, we leverage our engineering expertise, advanced equipment, and global manufacturing standards to deliver RO4003C™-based PCBs that perform consistently across diverse applications — from wireless communications to aerospace electronics.
For reliable, high-frequency PCB solutions with unmatched performance and precision, KKPCB is your trusted manufacturing partner.
