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Megtron 7 PCB: Ultra-Low Loss High-Speed PCBs for Advanced Digital and RF Systems

February 4, 2026by kkpcb04重试  错误原因0

What Is a Megtron 7 PCB?

Panasonic Megtron 7 laminate
Panasonic Megtron 7 laminate

A Megtron 7 PCB is a high-performance printed circuit board built using Panasonic Megtron 7 laminate, developed for ultra-high-speed digital and high-frequency signal transmission.

Megtron 7 PCBs are widely used where signal integrity, extremely low transmission loss, and stable impedance control are critical, such as 5G routers, data-center equipment, ADAS systems, and high-speed test boards.

Key Material Properties of Megtron 7 PCB

Panasonic Megtron 7 laminate offers industry-leading electrical performance:

  • Dielectric constant (Dk): ~3.2

  • Ultra-low dissipation factor (Df): ~0.001

  • Excellent thermal reliability

  • Low moisture absorption

  • Superior dimensional stability

These properties make Megtron 7 PCB ideal for ultra-low loss PCB and high-speed PCB applications.

Advantages of Megtron 7 PCB

Using a Megtron 7 PCB provides significant technical advantages:

  • Extremely low insertion loss at high data rates

  • Outstanding signal integrity for high-speed interfaces

  • Stable impedance across wide frequency ranges

  • Excellent performance in multilayer designs

  • High reliability for long-term operation

Because of these advantages, Megtron 7 PCB is considered a premium solution for advanced systems.

PCB Design Considerations for Megtron 7 PCB

To fully utilize Megtron 7 PCB material, designers should focus on:

  • Precise impedance controlled PCB design

  • Stack-up optimization for high-speed signals

  • Minimized crosstalk and skew

  • Low-profile copper foil selection

  • Careful via and transition design

Close coordination between PCB design and manufacturing is essential for achieving ultra-low loss performance.

Manufacturing Requirements for Megtron 7 PCB

Manufacturing a high-quality Megtron 7 PCB requires advanced process control:

  • Tight dielectric thickness tolerance

  • High-precision multilayer alignment

  • Controlled copper surface roughness

  • Advanced lamination and drilling processes

  • Comprehensive impedance and electrical testing

Only experienced manufacturers can consistently deliver reliable Megtron 7 PCBs.

Applications of Megtron 7 PCB

Megtron 7 PCBs are widely used in:

  • High-speed networking and switching equipment

  • 5G routers and communication systems

  • Data-center and cloud infrastructure

  • ADAS and automotive electronics

  • High-speed test and measurement systems

  • Advanced computing and AI hardware

They are essential wherever high-speed and low-loss signal transmission is required.

Conclusion

 

A Megtron 7 PCB delivers exceptional signal integrity, ultra-low loss, and long-term reliability for the most demanding high-speed and high-frequency applications. Its advanced material properties make it a preferred choice for next-generation electronic systems.

Choosing a professional Megtron 7 PCB manufacturer ensures accurate impedance control, consistent quality, and dependable performance from prototype to mass production.

Megtron 7 PCB

MEGTRON-7 Series Part Number

There might be some differences in UL certification conditions between the existing part numbers and the new part numbers.

MEGTRON 7 New Part Number Existing Part Number
Laminate Prepreg Laminate Prepreg
Low Dk Glass Cloth R-578Y(N) R-568Y(N) R-5785(N) R-5680(N)
Low Dk Glass Cloth
Improved Processability		 R-578Y(GN) R-568Y(GN) R-5785(GN) R-5680(GN)
Normal Glass Cloth
Improved Processability		 R-578Y(GE) R-568Y(GE) R-5785(GE) R-5680(GE)
Buried Resistor Copper Foil R-578Y(R) – R-578Y(R) –

MEGTRON-7 General Properties

Item Test method Condition Unit MEGTRON 7
R-578Y(N) R-5785(N)		 MEGTRON 7
R-578Y(GN) R-5785(GN)		 MEGTRON 7
R-578Y(GE) R-5785(GE)
Low Dk Glass Cloth Low Dk Glass Cloth Normal Glass Cloth
Glass Transition Temp (Tg) DSC A °C 200 200 200
CTE z-axis α1 IPC-TM-650 2.4.24 A ppm/°C 42 42 42
α2 280 280 280
T288 (with copper) IPC-TM-650 2.4.24.1 A min ＞120 ＞120 ＞120
Dielectric Constant (Dk) 13GHz
14GHz		 Balanced-type Circular Disk Resonator C-24/23/50 – 3.31 @14GHz 3.31 @14GHz 3.60 @13GHz
Dissipation Factor (Df) 0.0023 @14GHz 0.0023 @14GHz 0.0034 @13GHz
Peel Strength* 1oz (35μm) IPC-TM-650 2.4.8 A kN/m 0.8 0.8 0.8

R-5785(N) & R-578Y(N) Specification

Properties Units Test Method Condition Typical Value
R-5785(N)
Low-Dk Glass		 R-578Y(N)
Low-Dk Glass
Thermal Properties
Glass Transition Temp (Tg) ℃ DSC As received 200 200
DMA 210 210
Thermal Decomposition Temp (Td) ℃ TGA 400 400
Time to Delam (T288) Without Cu min IPC TM-650 2.4.24.1 ＞120 ＞120
With Cu ＞120 ＞120
CTE: α1 X-axis ppm/℃ IPC TM-650 2.4.24 ＜Tg 14-16 14-16
Y-axis 14-16 14-16
Z-axis 42 42
CTE: α2 Z-axis ＞Tg 280 280
Electrical Properties
Volume Resistivity MΩ-cm IPC TM-650 2.5.17.1 C-96/35/90 1×10⁹ 1×10⁹
Surface Resistivity MΩ 1×10⁸ 1×10⁸
Dielectric Constant (Dk) @ 1GHz – IPC TM-650 2.5.5.9 C-24/23/50 3.37 3.37
@ 14GHz Balanced-type Circular Disk Resonator 3.31 3.31
Dissipation Factor (Df) @ 1GHz IPC TM-650 2.5.5.9 0.001 0.001
@ 14GHz Balanced-type Circular Disk Resonator 0.0023 0.0023
Physical Properties
Water Absorption % IPC TM-650 2.6.2.1 D-24/23 0.06 0.06
Peel Strength 1 oz (H-VLP) kN/m IPC TM-650 2.4.8 As Received 0.8 0.8
Flammability – UL 94V C-48/23/50 94V-0* 94V-0

R-578Y(GE) & R-578Y(GN) Specification

Properties Units Test Method Condition Typical Value
R-578Y(GE)
E Glass		 R-578Y(GN)
Low-Dk Glass
Thermal Properties
Glass Transition Temp (Tg) ℃ DSC As received 200 200
TMA 190 190
DMA 210 210
Thermal Decomposition Temp (Td) ℃ TGA 400 400
Time to Delam (T288) Without Cu min IPC TM-650 2.4.24.1 ＞120 ＞120
With Cu ＞120 ＞120
CTE: α1 X-axis ppm/℃ IPC TM-650 2.4.24 ＜Tg 14-16 14-16
Y-axis 14-16 14-16
Z-axis 42 42
CTE: α2 Z-axis ＞Tg 280 280
Electrical Properties
Volume Resistivity MΩ-cm IPC TM-650 2.5.17.1 C-96/35/90 1×10⁹ 1×10⁹
Surface Resistivity MΩ 1×10⁸ 1×10⁸
Dielectric Constant (Dk) @ 1GHz – IPC TM-650 2.5.5.9 C-24/23/50 3.63 3.37
@ 13, 14GHz Balanced-type Circular Disk Resonator 3.60 @13GHz 3.31 @14GHz
Dissipation Factor (Df) @ 1GHz IPC TM-650 2.5.5.9 0.002 0.001
@ 13, 14GHz Balanced-type Circular Disk Resonator 0.0034 @13GHz 0.0023 @14GHz
Physical Properties
Water Absorption % IPC TM-650 2.6.2.1 D-24/23 0.06 0.06
Peel Strength 1 oz (H-VLP2) kN/m IPC TM-650 2.4.8 As Received 0.8 0.8
Flammability – UL 94V C-48/23/50 94V-0 94V-0

R-5785(GE) & R-5785(GN) Specification

Properties Units Test Method Condition Typical Value
R-5785(GE)
E Glass		 R-5785(GN)
Low-Dk Glass
Thermal Properties
Glass Transition Temp (Tg) ℃ DSC As received 200 200
TMA 190 190
DMA 210 210
Thermal Decomposition Temp (Td) ℃ TGA 400 400
Time to Delam (T288) Without Cu min IPC TM-650 2.4.24.1 ＞120 ＞120
With Cu ＞120 ＞120
CTE: α1 X-axis ppm/℃ IPC TM-650 2.4.24 ＜Tg 14-16 14-16
Y-axis 14-16 14-16
Z-axis 42 42
CTE: α2 Z-axis ＞Tg 280 280
Electrical Properties
Volume Resistivity MΩ-cm IPC TM-650 2.5.17.1 C-96/35/90 1×10⁹ 1×10⁹
Surface Resistivity MΩ 1×10⁸ 1×10⁸
Dielectric Constant (Dk) @ 1GHz – IPC TM-650 2.5.5.9 C-24/23/50 3.63 3.37
@ 12GHz Balanced-type Circular Disk Resonator 3.61 3.35
Dissipation Factor (Df) @ 1GHz IPC TM-650 2.5.5.9 0.002 0.001
@ 12GHz Balanced-type Circular Disk Resonator 0.003 0.002
Physical Properties
Water Absorption % IPC TM-650 2.6.2.1 D-24/23 0.06 0.06
Peel Strength 1 oz (H-VLP2) kN/m IPC TM-650 2.4.8 As Received 0.8 0.8
Flammability – UL C-48/23/50 94V-0 94V-0

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