Quick Reference Processing Guidelines CLTE Series Laminates

CLTE Series Laminates – High-Frequency PCB Processing Guidelines by KKPCB

At KKPCB, we specialize in high-frequency and microwave PCB manufacturing using premium materials such as the CLTE Series laminates.
These laminates are engineered for precision, stability, and reliability in RF, microwave, and millimeter-wave applications — ideal for radar systems, satellite communication modules, and high-speed network boards.

Follow the guidelines below to ensure optimized fabrication and zero-defect PCB performance.

1. Storage and Handling

Storage Environment

• Store laminates flat in a clean, dry, temperature-controlled area.

• Maintain ambient conditions between 20–25°C (68–77°F) with relative humidity below 50%.

Handling Precautions

• Always use clean, lint-free gloves to prevent surface contamination.

• Avoid bending or creasing the laminates to prevent micro-cracking or resin stress.

2. Drilling Process

Tooling

• Use carbide or diamond-coated drill bits for precise, burr-free vias.

• Match entry and backer materials to laminate hardness to reduce burrs and smear.

Recommended Parameters

• Entry Speed: 150–180 SFM

• Retract Speed: 350–400 SFM

Post-Drill Cleaning

• Perform controlled deburring to prevent delamination and dielectric damage.

3. Etching Process

• Compatible with standard copper etching solutions used in microwave PCB fabrication.

• Apply controlled etching rates to minimize undercuts and maintain uniform line width.

4. Lamination Process

Preconditioning

• Pre-bake laminates at 150°C (302°F) for 30–60 minutes to remove residual moisture.

Lamination Cycle

• Temperature: 200–220°C (392–428°F)

• Pressure: 200–300 psi

• Hold Time: 30–60 minutes at peak temperature

• Cooling: Maintain pressure during cooling to prevent voids and warping.

5. Plating Process

Surface Preparation

• Clean and degrease thoroughly before plating.

• Use plasma or chemical treatments to enhance copper adhesion.

Plating Method

• Both electroless and electrolytic copper plating are compatible with CLTE laminates.

• Ensure uniform copper thickness for consistent RF signal performance.

6. Routing and Cutting

Tooling & Process

• Use CNC routers with carbide or diamond bits for smooth edges.

• Laser cutting is also suitable for fine-feature RF PCB profiles.

Parameters

• Optimize feed rate and spindle speed to reduce edge chipping and layer delamination.

7. Key Considerations

• Maintain clean-room conditions during fabrication to ensure signal integrity.

• Continuously monitor process stability to achieve tight tolerance control.

• Follow KKPCB’s zero-defect manufacturing philosophy to deliver reliable RF and microwave PCBs.

🔧 Quick Reference Summary